Thanks everyone for suggestions!
I spent a long time analyzing the companies in the fallout world and modified the list. What do you think now?
Hardware Upgrades: Processors
Basic
Description: Single-Core 1.5GHz, Intelligence -1 Basic AI Mainframe. Up to 5 applications simultaneously.
Model Name: Damaged Zax 1.0 Based Core
Requirements: Socket 139, Basic Cooling System.
Update 1
Description: Single-Core 2.3GHz, Intelligence +0, Basic AI Mainframe. Up to 8 applications simultaneously.
Model Name: Zax 1.2 Based Core
Requirements: Socket 139, Basic Cooling System.
Update 2
Description: Dual-Core 2.5GHz, Intelligence +1, Intermediary AI Mainframe. Up to 15 applications simultaneously.
Model Name: Derek ODYSSEUS Core
Requirements: Socket 149, Intermediary Cooling System.
Update 3
Description: Quad-Core 2.7GHz, Intelligence +2, Advanced AI Mainframe. Up to 25 applications simultaneously.
Model Name: A.R.E.S. T2-14 Core
Requirements: Socket 364, Advanced Cooling System.
Hardware Upgrades: Ram Memory
Basic:
Description: Single Channel, DDR 400MHz, 512MB.
Model Name: GAI Basic RAM Memory.
Requirements: DDR compatible MB
Update 1
Description: Single Channel, DDR2 667MHz, 1024MB.
Model Name: GAI RAM Memory.
Requirements: DDR2 compatible MB
Update 2
Description: Dual Channel, DDR3 1333MHz, 2048MB.
Model Name: Robco Memory.
Requirements: DDR3 compatible MB
Update 3
Description: Dual Channel, DDR5 1800MHz, 4096MB.
Model Name: Robco Advanced Memory.
Requirements: DDR5 compatible MB
Hardware Upgrades: Holodisk
Basic:
Description: Wattz Heavily Fragmented Holodisk 256Gb
Update 1
Description: Wattz Fragmented Holodisk 512Gb
Update 2
Description: Wattz Manufactured Holodisk 1024GB
Update 3
Description: Wattz Manufactured Crystal Holodisk 4096GB
Hardware Upgrades: Motherboard
Basic:
Description: GAI Chipset, 1x Memory socket, 1x Holodisk Connector, DDR, Socket 139.
Model Name: Damaged A.R.E.S. prototype MB.
Requirements: --
Update 1
Description: H&H Chipset, 1x Memory socket, 1x Holodisk Connector, DDR and DDR2, Socket 149, Compatible with socket 139 with reduced performance.
Model Name: A.R.E.S. prototype MB.
Requirements: --
Update 2
Description: Robco Advanced Chipset, 1x Memory sockets, 2x Holodisk Connector, DDR2 and DDR3, Socket 364 Compatible with socket 149 with reduced performance.
Model Name: A.R.E.S. MB.
Requirements: --
Update 3
Description: Acme Advanced Chipset, 2x Memory sockets, 2x Holodisk Connector, DDR5, Socket 364.
Model Name: Advanced A.R.E.S. MB.
Requirements: --
Cooling System:
Basic:
Description: Heatsink, no fan. Normal Tubes. Agility -1
Model Name: Vault-Tec Basic Cooling System
Requirements: Water
Update 1
Description: Radiator and Carbon Fiber tubes. Agility +0
Model Name: Vault-Tec Intermediary Cooling System.
Requirements: Water, preferably purified to better performance.
Update 2
Description: Hydrogen Cooling System. Agility +1
Model name Big MT Advanced Cooling System.
Requirements: Purified water.
Sensor Array:
Basic:
Description: Basic camera sensor. PER -1 at Night.
Model Name: Codac R9000 sensor.
Requirements: --
Update 1
Description: Motion sensor. PER +0
Model Name: Wattz C-U model motion detector
Requirements: --
Update 2
Description: Camera with zoom and Wifi sensor. Perception +1, +10% weapon bullet range.
Model name: Acme HR 1205 Advanced Sensor
Requirements: --
Mechanic system: Plates
Basic:
Description: Cracked Ceramic Plating. Damage Resist: -3%, DR -3, -2HP(sec) when swimming.
Model Name: Damaged A.R.E.S. ceramic prototype plating.
Requirements: --
Update 1
Description: Ceramic Plating.
Model Name: A.R.E.S. ceramic plating
Requirements: Strength 4.
Update 2
Description: Basic Titanium Alloy plating. Damage Resist: +3%, DT+3, Agility +1.
Model Name: A.R.E.S. Titanium Alloy plating.
Requirements: Strength 6, Endurance 6.
Update 3
Description: Sealed Titanium Alloy plating. Damage Resist: +5%, DT+5, Agility +1, Rad Resist: +10%.
Model Name: Sealed A.R.E.S. Titanium Alloy plating.
Requirements: Strength 7, Endurance 7.
Mechanic system: Ligaments
Basic:
Description: Worn Out Skeleton Ligaments. Agillity -1, Speed Mult: -5%
Model Name: GAI Basic Ligaments.
Requirements: --
Update 1
Description: Oiled Skeleton Ligaments.
Model Name: West Tek Intermediary Ligaments.
Requirements: --
Update 2
Description: Advanced skeleton ligaments. Agility +1, Speed mult: +7%
Model Name: Acme C-27 skeleton ligaments.
Requirements: --